Winstek Semiconductor
Winstek Semiconductor Logo
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About Winstek Semiconductor
Winstek Semiconductor Co Ltd provides wafer and integrated circuit (IC) testing services for mixed signal, digital, optical, and radio frequency (RF) devices. The company offers a range of services including wafer sort, final and post-test, engineering support, and test platform services. It also provides wafer bumping services such as copper pillar bump, wafer level chip scale packaging, lead-free bump, plating bump, ball drop, RDL, heterogeneous bump, and backside metallization. Additional backend services include die processing, wafer thinning, singulation, and flip chip services, as well as verification analysis such as failure analysis and reliability testing.
Address
Qionglin Township, No. 176-5, Luliaokeng 6th Ling
Hsinchu City, 307410
Taiwan
Year founded
2000
Number of employees
900-1000
Sector
Information Technology
Industry Group
Semiconductors & Semiconductor Equipment
Industry
Semiconductors & Semiconductor Equipment
Subindustry
Semiconductor Materials & Equipment
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